backplane to expander board connector (BP_XCEDE_2) 3. XCede High Speed/Modular Connectors are available at Mouser Electronics. Login or REGISTER Hello, {0}. 2. For a 6-pair differential connector per column, 82. 4, 6 or 8 columns. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. We work with businesses, from pioneering start-ups to global brands, to find project-based or permanent talent that enables innovation in line with their vision and goals. The. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. Amphenol is the leader in high-speed, high-density connection systems, designing and manufacturing the industry's leading connectors and backplane systems. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. $19. 1. XCede® Connectors - Amphenol CS | DigiKeyFounded in 2003, our vertical specialists provide global transformational talent in data, product, software, cloud and cyber. The XCede ® HD Plus backplane connector achieves high . The XCede HD connector. 99. XCede® connectors also address. The vertical header range also includes. 2” Long 694-4529-000 – 2-Pair RAM Loading Head 2. Get a Free Sample. 3A per pin current rating and mount individually to the backplane. Manufacturer of Connector and Connector Systems. 2. Other items. 3. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card, providing up to 82. FCI released XCede vertical backplane headers and right-angle daughter card receptacles designed for 25 Gb/s performance. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. 00: L: Pressfit: 5: Power or coax contacts, Multi Purpose Centre, Location Peg1. xcede hd backplane assembly 4 pair connector, leadfree part no. Page 174 Figure 127. 99. They can either add a new cabling solution with backplane components at right angles, or expand their systems horizontally. Skip to Main Content. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating. Accepts 1. 2. the use of advanced engineering polymers in a unique 3-D resonance. XCede® connectors also address. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede ® HD and XCede ® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 2 Reference Documents TB-2235 XCede HD General Product Specifications TB-2237 XCede HD Routing Guidelines TB-2252 XCede HD Backplane Connector Installation 2. Yelp is a fun and easy way to find, recommend and talk about what’s great and not so great in Victoria and beyond. XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingThe XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Sloan 2-09-09 “A” S1979 Updated procedure, and addition of RAM and Stacker M. Please confirm your currency selection:2. Those components include CPUs, GPUs, SSDs, Hard Drives, Sound Cards, and Wi-Fi Cards, among others. Amphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards. Contact us today for more details of XCede HD, part number 968-4200-A1H. The diagram below, created by NTT DATA based on the IDS-RAM Information Model *3, shows the basis of data model. XCede High Speed/Modular Connectors are available at Mouser Electronics. Back. Two press-fit sizes, (standard and small) provide board layout options for designers. 3. 2" long and has an x4 connector. Change LocationAmphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. 1. 1. 特色. Contact Mouser (USA) (800) 346-6873 | Feedback. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . 1K+ bought in past month. Connector, XCede HD Series, 100 Contacts, 1. The connectors are intermatable, electrically and mechanically interchangeable. XCede® RAM. The XCede backplane connector system provides mechanical longevity and ruggedness required by today’s systems. 60mm Gen-Z connectors conform to SFF-TA-1002, OCP NIC 3. Revision “D” Specification Revision Status . 7. Samtec XCede High Speed / Modular Connectors are available at Mouser Electronics. 1. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. The 0. 3. Available in industry-standard 2. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Login or REGISTER Hello, {0}. 2 Pair. 1. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. 7. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Login or REGISTER Hello, {0}. Sign Up or Register. § Differential pairs 28-84 per inch (11-33 differential pairs perAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. screw length and part number are dependent on daughtercard thickness (as specified from configurator). XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Login or REGISTER Hello, {0}. (1) Notes1: XCede HD RAM and XCede HD Inverted RAM use the same tool of XCede HD Daughter. The XCede HD2 connector family consists of modular configurations with custom power and guidance. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. TARGET MARKETS. DETAILS. Additional RAM allows a computer to work with more information at the same time, which usually has a considerable effect on total system. XCede® HD 1. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The XCede® Right-Angle Male (XCede® RAM) connector is an intelligent device that offers two options for designers. Xcede's first Data Networking Event in Manchester was a great success, and we can't thank the incredible team at Moneysupermarket enough for co-hosting with us at their fantastic Manchester office. 1 DOCUMENTS 2. 0 REFERENCE 2. XCede® connectors also address. DC Connector Configurations XCede HD connector system. 2 Host Interface Connector The BCM957504-N425G OCP network adapter interfaces with the system baseboard via the gold fingers compliant with the SFF-TA-1002 specification. SCOPE Content This specification covers the performance, test and quality requirements for XCede product family interconnect systems. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. Login or REGISTER Hello, {0}. challenging architectures. Connectors; High Speed Board-to-Board; Micro Pitch Board-to-Board; Rugged / Power; Edge Card; Backplane / Micro Backplane; Standard Board-to-Board; Industry Standards;. 4 FMC+ VITA 74 VNX适用于密度关键型应用的小型高密度背板系统，采用模块化设计并提供可选功能，以提升灵活性和实现可定制解决方案。XCede® BACKPLANE CONNECTOR SYSTEM - FCI. was founded in 1987 with the mission of becoming a specialty connector manufacturer, delivering highest quality products and providing unparalleled customer service. Mouser offers inventory, pricing, & datasheets for Samtec XCede High Speed / Modular Connectors. XCede ® HD2 §XCede ® and AirMax are excellent and proven board-to-board connectors for backplane, mezzanine, orthogonal, or coplanar solutions up to 25Gb/s. 7mil Drill Minimum Pad Size vs. Vertical or Right Angle. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The SMA (or Sub-Miniature A) connector has a 50Ω impedance and can handle frequencies up to 17 GHz. EIA-364-B Electrical Connector Test Procedure Including Environmental Classifications 2. BENEFITS. FEATURES. The XCede HD interconnect platform also has available RAM (Right Angle Male). BACKPANEL CONNECTORS BACKPLANE CONNECTOR SYSTEM XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. EachAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. These connectors are available in 3-, 4- and 6-Pair configurations. 三个等级的上电次序实现了热插拔. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 0 REFERENCE 2. 80mm Right-Angle Backplane Receptacle (HDTF) From: £2. XCede. If you use the QSFP transceivers in the QSFP28 100G port, keep in mind that you have both single-mode and multimode (SR/LR) optical transceivers and Twinax/AOC options that are. 1. XCede ® HD2 was introduced to support PCIe ® 5 and XCede ® HD3 (in development) is targeting support of 112G PAM4 with future PCIe ® Gen 6 support in. 3. Amphenol is one of the leading manufacturers of Backplane connectors. $ 129. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Amphenol Communications Solutions XCede high-performance backplane connector system. jx410-51594 rev drawing no. XCede® connectors also address. Nashua, NH, February 2, 2009– Amphenol TCS, the leading provider of high performance backplane interconnect systems, today announced two additions to the XCede® connector platform – XCede 85 Ohm and XCede cables and assemblies. We would like to show you a description here but the site won’t allow us. Amphenol Communications Solutions XCede high-performance backplane connector system. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co-planar applications. XCede HD achieves the highest performance in an HM compatible form factor. 0 specification. Integrated guidance, keying and polarizing side walls available. DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co -planar applications. 4, 6 or 8 columns. DETAILS. DDR SDRAM - Evolution of High-Performance Volatile Memory. - FCI. 2 The daughtercard connector building blocks include signal modules, power modules, guidance/polarizing modules and grounded guidance modules that are all assembled to a metal organizer (stiffener). Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. 12 - 48 pairs. Contact Mouser (USA) (800) 346-6873 | Feedback. Advanced Search. Login or REGISTER Hello, {0}. Amphenol TCS XCede® Backplane Connectors. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede® HD是一个采用. XCede HD PLUS & XCede HD2 daughtercard single wafer replacement. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. . VVG-Befestigungstechnik GmbH & Co. Spacone 5-29-12 The XCede® Right-Angle Male (XCede® RAM) connector allows designers to grow their systems horizontally or add a new cabling solution by creating traditional. Improves signal integrity and increases signal. Change Location. Resource The top level of the. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. FCI 159 KAMPONG AMPAT, KA, PLACE,. Search. Spacone 5-29-12 XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. § Differential pairs 28-84 per inch (11-33 differential pairs perAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Login or REGISTER Hello, {0}. Article: 00028492. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. We chose the Asus Prime X470-Pro for its inclusion of many modern. 8 mm, Header, Press Fit. Features. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Ruggedized design for high reliability and ease of application. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Motherboard Diagram. 3. Get the best deals on Amphenol Backplane Connectors Connectors when you shop the largest online selection at eBay. Same mechanical benefits as backplane connectors; High pin counts, blind mate & high density; Low loss twin ax cable; Overcomes limitation of PCB materials; Linear transmission to ~30 GHz; Enables 25G NRZ and 56G PAM4; Flexible pin out; Allows for full mesh designs with cable harnesses; 30 - 26 AWG wire gauges; Optimization of transmission and. 80mm Right-Angle Backplane Receptacle; HDTF-6-08-S-RA-LC-100; HDTF - Samtec XCede® HD 1. XCede® connectors also address. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Our solutions include Wire-to-Board, Board-to-Board, Input/Output and FFC/FPC. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today’s . Farnell Ireland offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 三个等级的上电次序实现了热插拔. Submit a Brief. 2. 1. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. Buy XCede HD Series Backplane Connectors. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. XCede HD, XCede HD PLUS & XCede HD2 press fit backplane connector family onto a printed circuit board (PCB). Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. XCede® Connectors - Amphenol CS | DigiKeyAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. a SFP+ adapter that's super-short 3. High-speed, high-density backplane systems include ExaMAX ® and XCede ® HD in a variety of pair and column counts. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. The XCede ® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. DDR-SDRAM stands for Double Data Rate - Synchronous Dynamic Random Access Memory and it is a common type of memory used-organized RAM in most of the processors. 1 Fillets An extension of the pad at the interface of the trace to the pad that will allow more pad area in the event that the pad to hole registration compromises the interconnect area. 5 out of 5 stars 3,424. The standard XHD2 differential interconnect platform consists of connectors featuring 3, 4, or 6 differential pairs, with an optional extra ground lead available on the A wafer. 1. Designed to meet UL 1977 CAF (Conductive Anodic Filament) spacing Housing: High-temperature thermoplastic, UL94-V0 Wafers: High-temperature thermoplastic, UL94-V0 Contacts: High-performance copper alloy Platings. Description Initial Date “-“ S1188 Initial Release T. . The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. High-speed, high-density backplane systems include ExaMAX ® and XCede ® HD in a variety of pair and column counts. Amphenol is one of the leading manufacturers of Connectors. 2. These modules consist of a 12. English. Skip to Main Content (800) 346-6873. 1. Wang 2/18/16 C S7764 Updated document title, Added XCede HD2 backplane information B. 2. 7mil Drill Minimum Pad Size vs. They are available in 1. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. These connectors are two-piece devices that connect two printed circuit boards. 96 and 5. The company manufactures MIL-DTL-5015, both Front and Rear Release versions, MIL-DTL-83723 Series III, MIL-DTL-28748 rack and panel, Reverse Bayonet, and. 20mm Power Modules. Features. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 3. The applications for these connectors include IEEE 10GBASE-KR and 25GBASE-KR, or. 00 mm的触点滑动范围. 1 XCede HD 2 Pair Backplane Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall C-923-201E-500 2 Pair, 8 Column Differential Backplane Module, Thick Wall 高速背板系统. Accepts 1. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 3. 11. TARGET MARKETS. Lukin 10/01/13 “C” “D”. 54, 3. PDF 957-4100-AXX 4 PAIR POWER. See Appendix “A” for the seating press recommendations and process recommendations. 28G ADDITION TO THE XCEDE ® HD FAMILY XCede ® HD plus leverages the same. . 1 DOCUMENTS 2. Connectors with six differential pairs per column fit 36 mm minimum card slot pitch and provide 82. 062") thick cards. XCede® Family Cable Assemblies § Extends the reach of passive copper for next generation real world system designs; complementary with direct orthogonal designs, intermatable with existing board mount connector designs § Lowers overall system costs by reducing or eliminating the need for expensive active devices like retimers and high TB-2253 XCede HD Family Daughtercard Wafer Removal and Replacement. for connector repairability. If you need to add wires, there is an additional cost: please contact us and we will help you get the order processed. 54 - 5. Specs Kit. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today's challenging architectures. 85. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede ® HD is a small form factor system with a modular design for significant space savings and. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. Xcede® HD High Speed Backplane Connectors. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 3A per pin current rating and mount individually to the backplane. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. 80 mm High-Density Backplane Right-Angle Receptacle. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Figure 20: Example XCede® HD Midplane Connector 20 LIST OF TABLES Table 1: XCede® HD , XCede® HD Plus and XCede® HD2 15. This card can be used in an ITX system with an M. 2 The daughtercard connector building blocks include signal modules, power modules,. 00 mm的触点滑动范围. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed/Modular Connectors. 2. com. 11. Features & Benefits. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal. Dislaime Please note that the above information is subect to change without notice. EN. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Standard or high-speed wafers available. Typically, XCede compliant pins will require an insertion force of 2-10 lbs/pin. Buy 10113949-L0E-20DLF - Amphenol Communications Solutions - Connector, FCI XCede Series, 32 Contacts, Header, Press Fit, 8 Rows. Amphenol Communications Solutions XCede high-performance backplane connector system. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. Login or REGISTER Hello, {0}. 1. Xcede's first Data Networking Event in Manchester was a great success, and we can't thank the incredible team at Moneysupermarket enough for co-hosting with us at their fantastic Manchester office! 🤝🏙️ Excellent insights were shared by our distinguished speakers: 🌟 🎙️ Jon Howard from the BBC 🎙️ Chris Soulier from Cinch 🎙️ Gemma Turner from The Very. 40mm pitch, supporting speeds up to 32Gb/s (BergStik ®, Dubox ®, Minitek ®, BergStak ®, Conan ®, Rib-Cage ® ). Three levels of sequencing enable hot plugging. Distance Curve of MEP-12T press for XCede and XCede Plus connectors. Four-pair connectors provide 54. 2 617-0450-014 xcede hd 4pair stiffener 1 1 922-421f-d3h xcede hd 4pair lc mod w/ organizer, 8pos, 100ohms, bifurcated, . The inserts can be installed as per the. Mouser offers inventory, pricing, & datasheets for XCede High Speed/Modular Connectors. 2. Power blades rated up to 60 A per power bank. Contact us today for more details of XCede HD, part number 970301YD2B. 60mm (. Login or REGISTER Hello, {0}. These connectors are ideal for meeting a wide variety of application needs, including Ethernet and PCI. The XCede ® HD Plus backplane connector achieves high . These connectors are two-piece devices that connect two printed circuit boards. Amphenol solves system design challenges with integrated interconnect solutions for applications in the networking, communications, storage, and computer server markets. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. high speed performance, paddle card edge connector series for next Gen. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. challenging architectures. After the reboot, the 40G port light turns yellow, which means the 40G-10G split configuration is successful. signal connector (J_BP_SIG) 5. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. Up to 82 differential pairs. Contact us today for more details of XCede, part number 922-440G-F3H Toggle Nav. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal,. And each fiber cable transmits at 10Gbps. XCede connectors also meet higher linear signal density requirements at backplane or midplane interfaces. Samtec XCede® HD 3. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane interconnect systems. A Loyalty Bonus Cash of $1,500 (applied after taxes) is offered on all new 2022 Ram 1500 Classic models and applies to current and original owners of a Chrysler, Dodge, Jeep,. 4. Send us a Message. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. Change Location. English. Complementary guide and power modules are also included in the product range. XCEDE® BACKPLANE CONNECTOR SYSTEM XCEDE® POWER SYSTEM 150 grams normal force nominal POWER RATING Modular construction gives an effective current density of 8. XCede® connectors also address. The Molex EXTreme LPHPower Connector is a mixed, high current power and signal connector system that picks up where traditional connectors leave off. 12 - 48 pairs. 2. XCede Product Family Connector Press-fit Installation Process . Kuject 320 PCS Heat Shrink Wire Connectors, Multipurpose Waterproof Electrical Wire Terminals kit, Insulated Crimp Connectors Ring Fork Spade Butt Splices for Automotive Marine Boat Truck. Brand of Product：Amphenol ICC,Part#：946-230X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. This specification covers the performance, test, and quality requirements for the XCede HD backplane interconnect system. SIMM was one of the earliest multichip memory modules used in PCs, generally with 30pins and 70pins, and a 32–bit data path. Integrated guidance, keying and polarizing side walls available. Connector & Configuration Pair Size Product type Columns XCede HD Backplane 3 4 6 8 12 14 24 15 22 30 40 44 Vertical Header Signal Vertical Header Signal Vertical Header Signal Standard Enhanced Enh Gen 2 Vertical Receptacle Power R/A Header Power R/A Receptacle Guide ModuleXCede High Speed / Modular Connectors are available at Mouser Electronics. See Figure 15 for details. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Find Parts Learn More. XCede® HD 1. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Separate the interface from 40G to four 10G. Ruggedized design for high reliability and ease of application. The applications for these connectors include IEEE 10GBASE-KR and 25GBASE-KR, or OIF CEI-6G, CEI-11G, CEI-28G. Copper Weight and Annular Ring (“A/R”) 7 Table 2: XCede® HD and XCede® HD Plus 17. Amphenol TCS XCede Backplane Connectors feature up to 82 differential pairs as well as 2-, 3-, 4-, 5-, and 6-pair configurations. 9 signal pairs per inch are.